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| DIMM 72 pin IC-554 Series IC-554- 1- ** Socket Series Design No. N: Without Mounting Flange MF: With Mounting Flange Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Characteristics 1,000M1/2minimum at 500 VDC 700 VAC for 1 minute 30m1/2 max. at 10mA/20mV (Initial) -55uC ~ +170uC Material PEI (Glass Filled) Beryllium Copper Gold over Nickel Insulator: Contact: Plating: 98.00 0.4 89.00 0.2 80.00 0.4 0.635 0.1 1.27x35=44.45 0.2 1.27x17=21.59 REF 1.27x18=22.86 REF. 1.27 0.1 C IC-554-1 2-DIA3.20 Thru Hole 17.00 17.78 6.35 59.69 0.67 +0.1 0 1.27 0.1 1.27x35=44.45 -0.2 25.35 Front 54.00 +0.2 0 7.62 1.02 0.03 1.27 0.03 44.45 0.05 1.00 +0.09 -0.07 Back (2.00) 51.66 1.27x35=44.45 0.05 (1.27x17=21.59) 2.00 (Position of IC) (1.27x18=22.86) 2-1.80 0.05 17.78 1.80 Back Detail C (Back) IC Device Dimensions (Reference Dra ing) w IC Device Dimensions (Reference Drawing) 98.00 REF . 89.00 0.1 1.27x35=44.45 0.1 (1.27x17=21.59) (1.27x18=22.86) 1.27 0.05 0.635 0.05 M AX 30 8.04 0.05 4.84 0.05 .00 2-DIA.3.20 +0.1 0 Thru Hole 1.27 0.05 1.27x35=44.45 0.1 P.C.BOARD HOLE PATTERN Pattern Shown Looking Down Through Top of Socket. 72-DIA0.80 +0.1 0 Thru Hole (Position of IC) For Positioning Pin 2.30 0.1 SEC. D-D 35 |
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